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5847 / 2024

Materials for interconnection structures –Part 5 : Sectional specification set for conductive foils and films with and without coating –Section 1: Copper foils ( for the manufacture of copper – clad base materials )

Endorsement Date

18-08-2024

Pages Count

0

Sector

Engineering

Committee Name

Electronic Components

Standard Type

Price

0 L.E.

Main References

(Stability date 2028) IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials

Standard Status

Update Adopted

Obligatory Status

Not Obligatory

Decisions Number

ICS

31.180